This wirebonder is presently in room A2550. This is an automatic wirebonder that can do ball-wedge, wedge-wedge and ribbon bonding. It can do gold balling for flip chip bonding. The subsrate to be wire bonded needs to be heated to 135 degree C to ensure good adhesion. It is actually setup for ball-wedge bonding with a 1mil (25um) gold wire. The ball size is 65 um diameter, 15 um height (20um if 2 ball or more are stacked). Rate: LACIME: $1.5 per wirebond Academic-ETS: $2 per wirebond Academic- external: $3 per wirebond Industrial: $4 per wirebond Available: -wire diameter of 0.8 mil (20um), elong:3-5%, tensile: 3 grams min SPL type. Ball 45um diameter, 10um height. Extra cost will be applied for setup change. -wedge-wedge bonding using 15 mils wide ribbon, 0.25 mil thick. Extra cost will be applied for setup change. IMPORTANT: must contact us one month before using to plan the bonding head change. Bonding on PCB: It is not allowed to bond on bare copper. When you design a PCB you must have Immersion gold (ENIG) for the surface to wirebond; ENEPIG is also acceptable, but much more expensive.