EquipmentAvailable
Finetech-PicoMa- Flip chip bonder-solder station
Faculté de génie
École de technologie supérieure (ETS)
The Fineplacer is an enhanced hot air rework station for assembly and rework of all types of SMD components. Application area from 0201 up to large BGA on small to medium sized PCBs. It also have an ultra sonic head to do flip chip bonding Location : A2541 Cleanroom
LaCIME - communications et microélectronique
Faculté de génie
Research lab focused on advancing scientific knowledge and innovation.
MG
Mathieu Gratuze
Faculté de génie
École de technologie supérieure (ETS)
EquipmentAvailable
Finetech-PicoMa- Flip chip bonder-solder station
Faculté de génie
École de technologie supérieure (ETS)
The Fineplacer is an enhanced hot air rework station for assembly and rework of all types of SMD components. Application area from 0201 up to large BGA on small to medium sized PCBs. It also have an ultra sonic head to do flip chip bonding Location : A2541 Cleanroom
LaCIME - communications et microélectronique
Faculté de génie
Research lab focused on advancing scientific knowledge and innovation.
MG
Mathieu Gratuze
Faculté de génie
École de technologie supérieure (ETS)
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