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    EquipmentAvailable

    Finetech-PicoMa- Flip chip bonder-solder station

    Quote on request

     

    The instrument

    The Fineplacer is an enhanced hot air rework station for assembly and rework of all types of SMD components. Application area from 0201 up to large BGA on small to medium sized PCBs. It also have an ultra sonic head to do flip chip bonding Location : A2541 Cleanroom

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    Fabrication
    LabGiant,

    on the shoulders of giants.

    Features

    Equipment CalendarProtocol CortexCRMImpact Reporting

    Explore

    Research IndexTechniquesCommunityPlans
    McGill UniversityConcordia UniversityUniversité de MontréalPolytechnique MontréalDobson Centre for EntrepreneurshipUniversity of Alberta
    © 2026 LabGiant
    EN|FR
    Privacy PolicyTerms of Service