The PIE Scientific Tergeo Plasma Cleaner, specifically the Tergeo-EM model, is an advanced and versatile RF plasma cleaning system optimized for TEM, SEM, and FIB applications. It utilizes low-pressure plasma technology to effectively remove organic contaminants and activate surfaces. The system supports both direct immersion (capacitively coupled) mode for aggressive cleaning and downstream (inductively coupled) mode for gentle cleaning of sensitive materials or TEM/STEM specimens mounted on SU-9000 sample holders. It is capable of pulsed plasma operation with adjustable duty cycles (0.4% to 100%) and supports various process gases including oxygen, argon, hydrogen, nitrogen, CF4, SF6, and water vapor. The RF power system operates at 13.56 MHz with output options of 0-75W or 0-150W, featuring automatic impedance matching. The Tergeo offers real-time plasma intensity monitoring and fully automated operation with support for up to 20 customizable recipes. Key applications include removing hydrocarbon contamination from TEM samples prior to imaging, activating in-situ TEM chip surfaces, removing carbon deposition after STEM imaging, and controlled hydrophobic/hydrophilic conversion of carbon-coated TEM grids and other surfaces.