
The Hitachi IM-4000Plus Ion Milling System is a state-of-the-art broad ion beam milling system designed for both cross-sectioning and flat milling of various materials. It employs a low-energy Ar+ ion beam to produce wider, undistorted cross-sections or flat surfaces without inducing mechanical stress on the sample. The system features advanced ion optics, enabling faster milling rates exceeding 500 μm/h at 6 kV for silicon, significantly reducing processing time. It offers an accelerating voltage range of 0 to 6 kV and various modes of stage rotation for optimal sample preparation prior to SEM observation. For thermally sensitive materials, an intermittent milling process is available to dissipate heat, and an improved cryo operation provides precise temperature control (0° to -100°C with LN2). The system ensures high precision of mask position alignment for site-specific cross-section milling and includes an air protection transfer system for oxidation-sensitive samples. A variable beam incidence angle allows for perfect smoothing (e.g., for EBSD analysis) or selective enhancement of surface features (relief milling). An optional high-resolution optical microscope enables live observation of the cross-section cutting area. The system can accommodate samples up to 50 mm in diameter and 25 mm in height.

Faculty of Engineering
Research lab focused on advancing scientific knowledge and innovation.
The Hitachi IM-4000Plus Ion Milling System is a state-of-the-art broad ion beam milling system designed for both cross-sectioning and flat milling of various materials. It employs a low-energy Ar+ ion beam to produce wider, undistorted cross-sections or flat surfaces without inducing mechanical stress on the sample. The system features advanced ion optics, enabling faster milling rates exceeding 500 μm/h at 6 kV for silicon, significantly reducing processing time. It offers an accelerating voltage range of 0 to 6 kV and various modes of stage rotation for optimal sample preparation prior to SEM observation. For thermally sensitive materials, an intermittent milling process is available to dissipate heat, and an improved cryo operation provides precise temperature control (0° to -100°C with LN2). The system ensures high precision of mask position alignment for site-specific cross-section milling and includes an air protection transfer system for oxidation-sensitive samples. A variable beam incidence angle allows for perfect smoothing (e.g., for EBSD analysis) or selective enhancement of surface features (relief milling). An optional high-resolution optical microscope enables live observation of the cross-section cutting area. The system can accommodate samples up to 50 mm in diameter and 25 mm in height.


Faculty of Engineering
Research lab focused on advancing scientific knowledge and innovation.
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