The Oxford Instrument PlasmaPro 100 Estrelas is a state-of-the-art Deep Reactive Ion Etching (DRIE) system designed for advanced micro- and nanofabrication. It offers exceptional flexibility for applications in Micro Electromechanical Systems (MEMS), advanced packaging, and nanotechnology. The system supports both Bosch and Cryogenic etching processes, enabling high etch rates, superior selectivity, and highly anisotropic (vertical) profiles. Researchers can achieve smooth sidewalls and high aspect ratio features. It accommodates a wide range of wafer sizes, typically from 50mm to 200mm, and utilizes a high-density plasma source with fast gas-switching capabilities. Common process gases include oxygen (O₂), argon (Ar), sulfur hexafluoride (SF₆), and octafluorocyclobutane (C4F8). The system is equipped with an advanced recipe editor, heated liners, and efficient wafer cooling for precise process control. It is particularly effective for deep etching of silicon, including the fabrication of through-silicon vias (TSVs).