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    EquipmentAvailable

    Oxford Instruments PlasmaLab System 100 reactive ion etcher

    Fluorine-based reactive ion etching with a load lock and 100 mm tooling, for Bosch and cryogenic silicon etch, oxide, nitride and metal etch.

    US$60 to US$135 / hourAll ratesView pricing

     

    The instrument

    Reactive ion etching (RIE) using fluorine-based gases, with 100 mm tooling and a load lock.

    Process capabilities: Bosch etch, silicon cryo-etch, silicon dioxide (SiO2) etch, silicon nitride (Si3N4) etch and metal etch.

    Rates

    Boise State researchers
    US$60 / hour
    Commercial
    US$135 / hour
    Everyone else
    US$85 / hour

    View pricing

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    Equipment CalendarProtocol CortexCRMImpact Reporting

    Explore

    Research IndexTechniquesCommunityPlans

    In partnership with

    McGill UniversityConcordia UniversityUniversité de MontréalPolytechnique MontréalDobson Centre for EntrepreneurshipUniversity of Alberta
    © 2026 LabGiant
    EN|FR
    Privacy PolicyTerms of Service