Overview: The O₂ Plasma Cleaner is designed for oxygen plasma cleaning, surface activation, and contamination removal, primarily used in research and development settings.

Key Features:

• Larger benchtop unit
• Adjustable RF power settings (Low, Medium, High)
• Includes a 6″ diameter x 6.5″ length Pyrex chamber
• Hinged door with viewing window
• Active fan cooling
• Integral switch for a vacuum pump

Technical Specifications:

• capacity: 6" diameter x 6.5" length chamber
• accuracy: Not specified
• precision: Not specified
• range: RF power settings from 30W to 45W
• speed: Minimum pump speed of 1.4 m³/hr (23 L/min)
• power: Maximum RF power of 45W
• dimensions: 11″ H x 18″ W x 9″ D

Applications: Ideal for nanoscale surface cleaning, surface chemistry modification, and etching organic thin films.